Ceramic supstrate

Ceramic-based copper clad laminate

Ceramic-based copper clad laminate

Silver-free AMB ceramic copper clad laminate

Silver-free AMB ceramic-based copper-clad circuit boards are produced by using a silver-free active metal brazing process. They represent a further development of DBC process technology and silver-based AMB technology, enabling effective brazing of various ceramic substrates such as Al2O3, ZTA, AlN, and Si3N4.Compared with DBC process technology and traditional AMB process technology, it has a thinner brazing layer,  higher performance and reliability. At the same time, it can also have a cost advantage comparable to DBC process technology, widely meeting the application requirements of high, medium and low power semiconductor   device products. While ensuring reliability, it provides sufficient thermal conductivity, electrical performance, mechanical performance and insulation performance.

Characteristics

● High bending strength

● Excellent thermal conductivity

● Low coefficient of thermal expansion

● Excellent cold and hot cycle performance

Application

●  High-power LED

● Semiconductor field

● TOF sensor

●  LGBT module field

● New energy vehicles

● Wind power generation

Technical parameters